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  http://www.shoulder.cn shoulder electronics limited page: 1 shoulder electronics limited ceramic resonator data sheet product ? : ceramic resonator model no : zttc s mt prepared : fengyu checked : york approved ? : lijiating date : 2008-01-25
1 scope this specification shall c over the characteri stics of the ceramic resonator 6.00 -13.00mhz. 2 part no. part number customer part no specification no zttc s mt 3 outline dimensions and mark 3.1 appearance: no visible damage and dirt. 3.2 construction: smd ceramic packaging. 3.3 the products conform to the rohs directive and national environment protection law. 3.4 dimensions and mark 4.70.2 1.950.2 1.950.2 4.10.2 0.80.2 0.80.2 1.40.2 input ground output *:eiaj monthly code 8.00* 4 electrical specifications 4.1 rating items requirement withstanding voltage (v) 50 (dc 1min) insulation resistance ri, m ? min. 100 10v 1min operating temperature -25 85 storage temperature -55 85 6v dc rating voltage u r v 15v p-p http://www.shoulder.cn shoulder electronics limited page: 2
4.2 electrical specifications items requirement oscillation frequency fosc mhz 6.00-13.00 frequency accuracy % 0.5 resonant impedance ro ? max. 30 temperature coefficient of oscillation frequency % max. 0.3 oscillation frequency drift -25 +85 oscillation frequency aging rate (%) max * 0.3 (from initial value) * components shall be left in a chamber of +852 for 1000 hours, then measured after leaving in natural condition for 1 hours. 5test 5.1 test conditions parts shall be tested under the condition ( temp. 2015 ,humidity 6520% r.h.) unless the standard condition(temp. 252 ,humidity 655% r.h.) is regulated to measure. 5.2 test circuit ic1/6tc4069ubp2 xceramic resonator input ground output 6 physical and environmental characteristics no item condition of test performance requirements 6.1 humidity keep the resonator at 40 2 and 90%-95% rh for 96h. then release the resonator into the room condition for 1h prior to the measurement. it shall fulfill the specifications in table 1. 6.2 high temperature exposure subject the resonator to 85 2 for 96h, then release the resonator into the room conditions for 1h prior to the measurement. it shall fulfill the specifications in table 1. 6.3 low temperature exposure subject the resonator to -25 2 for 96h, then release the resonator into the room conditions for 1h prior to the measurement. it shall fulfill the specifications in table 1. 6.4 temperature after temperature cycling of blow table was it shall fulfill http://www.shoulder.cn shoulder electronics limited page: 3
performed 5 times, resonator shall be measured after being placed in natural conditions for 1h. temperature time ?253 30 3 min cycling 853 30 3 min the specifications in table 1. 6.5 vibration subject the resonator to vibration for 2h each in x y and z axis with the amplitude of 1.5mm, the frequency shall be varied uniformly between the limits of 10 hz?55hz. it shall fulfill the specifications in table 1. 6.6 mechanical shock drop the resonator randomly onto a wooden floor from the height of 100cm 3 times. it shall fulfill the specifications in table 1. passed through the re -flow oven under the following condition and left at room temperature for 1h before measurement. 6.7 soldering test peak:260max 250 pre-heating 10s max within 80-120s. within 20-40s 30s min 230 150 100 it shall fulfill the specifications in table 1. to be continued 6 physical and environmenal characterisics no item condition of test performance requirements 6.8 solder ability dipped in 245 5 solder bath for 3s0.5 s with rosin flux (25wt% ethanol solution.) the terminals shall be at least 95% covered by solder. board bending 6.9 mount a glass-epoxy board (width=40mm,thickness=1.6mm),then bend it to 1mm displacement and keep it for 5s. (see the following figure) support bar press head press mechanical damage such as breaks shall not occur. http://www.shoulder.cn shoulder electronics limited page: 4
table 1 item specification after test oscillation frequency change fosc/fosc % max. 0.3 resonant impedance ro ? max. 35 the limits in the above table are refe renced to the initial measurements. 7 recommended land pattern a nd reflow soldering standard conditions 7.1recommended land patter n 7.2recommended reflow soldering standard conditions peak:260max 250 pre-heating 10s max within 80-120s. within 20-40s 30s min 230 150 100 http://www.shoulder.cn shoulder electronics limited page: 5
8 package to protect the products in storage and transportation it is necessary to pack them outer and inner package . 8.1 on paper pack, the following requirements are requested. 8.1.1 dimensions and mark 3 9 2 300 3 8 2 1 2 4 5 6 3 7 no. name quantity package 1 inner box 12 belt 2.9 m adhesive tape 1.2 m label 1 certificate of approval 1 company name ,address etc. 8.1.2 section of package package is made of corrugated paper with th ickness of 0.8cm.package has 12 inner boxes, each box has 5 reels(each reel for plastic bag) 8.1.3 quantity of package per plastic reel 1000 pi eces of piezoelectric ceramic part per inner box 5 reels per package 12 inner boxes 60000 pieces of piezoelectric ceramic part 8.1.4 inner box dimensions http://www.shoulder.cn shoulder electronics limited page: 6
1852 1 8 5 2 962 no. name quantity inner box 1 qc label 1 label 1 8.2 on reel pack, the followi ng requirements are requested. 8.2.1 reel dimensions a b w t pieces per reel carrier tape size 1803 60min 12.4min 19.4max 1000typ. 12 http://www.shoulder.cn shoulder electronics limited page: 7
8.2.3 packing method sketch map blank pocket 10 pitches loaded pocket blank pocket 10 pitches leader 200mm max 8.2.4test condition of peeling strength p e e l i n g s t re n g t h 2 0 - 7 0 g carrier tape top tape 10 max 9 eiaj monthly code 2005 / 2007 / 2009 2006 / 2008 / 2010 month code month code jan a jan n feb b feb p mar c mar q apr d apr r may e may s jun f jun t jul g jul u aug h aug v sep j sep w oct k oct x nov l nov y dec m dec z 10 other 10.1 caution 10.1.1 don?t apply excess mechanical stress to the component and terminals at soldering. do http://www.shoulder.cn shoulder electronics limited page: 8
not use this product with bend. 10.1.2 do not clean or wash the component for it is not hermetically sealed. 10.1.3 do not use strong acidity flux more than 0.2wt% chlorine content in flow soldering. 10.1.4 don?t be close to fire. 10.1.5 this specification mentions the quality of the component as a single unit. please insure the component is thoroughly evalua ted in your application circuit 10.1.6 expire date (shelf life) of the products is six months after deliv ery under the conditions of a sealed and an unopened package. please use the products within six months after delivery. if you store the products for a long time (more than six months), use carefully because the products may be degraded in the solderabilit y or rusty. please confirm solderability and characteristics for the products regularly. 10.1.7 please contact us before using the pr oduct as automobile electronic component. 10.2 notice 10.2.1 please return one of th is specification after your signature of acceptance. 10.2.2 when something gets doubtful with this speci fications, we shall jointly work to get an agreement. http://www.shoulder.cn shoulder electronics limited page: 9


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